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New 0.10 micron technology from Japan

The Japanese, who, as always, are trying to be “ahead of the locomotive”, recently reported on new achievements in the field of development <0,10 мкм техпроцессов. Tokyo Electron и Toshiba сообщили о том, что вместе они смогли достичь еще меньших коэффициентов в диэлектриках для использования в чипах, сделанных по 0,10 мкм технологии и меньше. А Fujitsu заявила, что она улучшила процесс отжига, основанный на применении дейтерия, который должен решить проблему устойчивости к "горячим носителям заряда" в будущих чипах.

Going back to the first two companies, their new method of depositing low k-number dielectrics on the surface of copper compounds allows this process to be carried out using a 19-electron beam, which can reduce the solidification time of copper to 2 minutes at 35C. And this is much faster than 30 minutes in a special furnace at a temperature of 400C, when it is impossible to get rid of the partial diffusion of copper into the dielectric. In short, all these manipulations allow achieving a stable k-value of 2.91, which is just right for a 0.10 μm process.

As for the prospects of this case, then, naturally, so far the whole mystery is taking place only in the laboratory. But no one has doubts that it will not be possible to put on a grand scale such a production with modern technologies of labor. Toshiba, by the way, already plans to start supplying trial equipment to its factories in the spring of 2021.

As for Fujitsu’s developments, they, in principle, are not new – the Americans thought of before annealing with deuterium. However, the Japanese, with their perseverance, were the first to achieve practical results. In the Fujitsu laboratory, the 0.13 micron process already uses such annealing, although, roughly speaking, it is still possible to do without it, as other companies have done. However, tests have shown that with the help of such a technological process, it is possible to increase the life of the microcircuit by almost twice compared with the usual treatment with hot hydrogen. In fact, deuterium technology is already applicable to chips made according to 0.09 micron technological standards.

However, like everything new, deuterium annealing is still expensive and the timing of its introduction into mass production is also not clear… One thing is clear – this technology is the future.

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