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Toshiba and DRAM: strategic castling
TAEC (Toshiba America Electronic Components) today announced a change to its memory strategy. Due to weak demand and “sluggishness” of the market, the company intends to close its factory Yokkaichi (Fab 1). 300 Fab 1 workers will be reassigned to other production facilities of the company.
The fact is that until now, Fab 1 produces up to 70 thousand 8-inch silicon wafers per month. They go to the manufacture of about 7 million. DRAM chips (64 Mbit equivalent) according to the standards of 0.20 micron technical process and up to one million. SRAM chips (4 Mbit equivalent) according to the 0.40 micron technical process, which is currently economically unprofitable. Fab 2, which will now bear the entire load, produces chips at rates of 0.175 microns and less. Fab 1, most likely, will be converted to produce more modern chips.
Toshiba plans to start production of 512 Mbit DRAM chips with 0.13 micron process technology already in the fourth quarter of 2021.