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TSMC – the first 0.1 micron chips
At DesignCon in San Jose, TSMC representatives demonstrated a chip made using the most advanced 0.1 micron process technology to date. TSMC hopes to be able to commission a pilot 0.1 micron line by the end of the year.
If nothing goes wrong with TSMC, it will become the first company to actually produce 0.1 micron chips, overtaking such indisputable authorities as IBM, Intel, etc.d. Intel, according to current information, will begin pilot production at 0.09 micron standards no earlier than the second quarter of next year. At the same time, IBM plans to do this.
At DesignCon, TSMC officials said an early partner campaign for the 0.1 micron process will begin soon, with working samples available in Q4.
Two development teams are working on 0.1 micron at TSMC R&D facilities: one team is developing a process for 200 mm, the other for 300 mm wafers. This, of course, is not a very reasonable approach, but TSMC has to resort to it in order to protect itself from possible troubles with the 300 mm equipment that has not yet been completely run in.
The latest lithographic 193-nm equipment from ASML – Twinscan 1100 AT will be used in the production of 0.1 micron process technology. ASML has long been the main partner of TSMC.
Well, let’s see if TSMC succeeds in overtaking American companies… With the introduction of the 0.13 micron technical process, everything did not go as smoothly as we would like.
Source: Silicon Strategies