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Intel goes 300mm

While 300mm factories are just being built and equipped in Taiwan, Intel has already begun mass production at its first 300mm 0.13μm D1C factory in Hillsboro, Oregon.

As you know, Intel relies heavily on 300 mm production in order to outrun its main competitor AMD in terms of costs for the release of the processor. It is visible – Intel has announced plans to build at least six 300 mm production facilities.

In addition to D1C, Intel will soon begin equipping its Rio Rancho, New Mexico (Fab11x) factory, which Intel first mentioned two years ago. Fab11x is also a 300 mm 0.13 micron production. Pilot production there should begin in the second half of the year.

Then, in the second half of 2021, pilot production is to begin at the Fab24 factory in Lakeslip, Ireland. Previously, this factory was planned as 200mm, but now Intel has decided to equip it with 300mm hardware, which pushed the launch date of the factory from the end of this year to the second half of 2021. Fab24 should be the first factory in which the company thinks to produce chips according to 0.09 micron technological standards.

In addition to these three, Intel plans to establish 300mm production at its existing factory in Chandler, Arizona, which was launched last year and now has a 200mm conveyor.

Intel is also building D1D – a factory where it will develop and put into mass production 0.07 micron technical process on 300 mm wafers. D1D will be located next to D1C in Hillsborough. However, no exact dates for this factory have been announced from Intel officials.

In the same Hillsboro, there is another RP1 purely research factory, which Intel opened last year. This R&D factory, albeit small ($ 250 million.), but they are exclusively engaged in research and production on 300 mm substrates.

Source: Silicon Strategies

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